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Semiconductor > Product > Semiconductor
 
Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  23  
   
  Pick and Place APP-L10 (wafer level)

1. Single Pick & Place System (Linear motor)

2. Wafer Expanding unit (8inch)

3. PRS Vision System for wafer alignment with lights

4. Map File Recognition

5. Machine base & body (Hepa filter attached)

6. Wafer Cassette Loading 30 ea

7. Earranty 12 months

8. UPH : min 5,000 ea

9. PC Based & Touch Monitor Control System

   
  22  
   
  Image Sensor Test IT-60AD (CMOS,CSP)
1.1. Multi JEDEC Tray loading

(Supply 2 / Empty 1 / Good 2 / Reject 2)

2. Pick up tool method by vacuum (6 unit pick up)

3. 6 Para testing unit

4. LED lighting use for image test

5. Contact method by pogo pin & cylinder up & down

6. Socket moving by turret system

7. Test result mapping display & save

8. Cycle time: 9 Sec (case by device spec.)

9. PC Based & Touch Monitor Control System
10. Application : 0.3 Mega ~ 8 Mega

   
  21  
   
  Image Sensor Test IT-40AD

1. Multi JEDEC Tray loading

(Supply 2 / Empty 1 / Good 2 / Reject 2)

2. Pick up tool method by vacuum
(4 unit pick up)

3. 4 Para testing unit

4. LED lighting use for image test

5. Contact method by pogo pin & cylinder up & down

6. Socket moving by turret system

7. Test result mapping display & save

8. Cycle time: 9 Sec (case by device spec.)

9. PC Based & Touch Monitor Control System

   
  20  
   
  Vision System AVS-4000

1. Waffle Tray load & unload
(Waffle pack to waffle pack)

2. Pick up method by vacuum (Servo motor)

- Single P&P for Reject Die

3. Map File Recognition

4. Vision inspection system 2 SETS

4. Possible Conversion 2 inch, 3 inch,
4 inch (optional)

5. Elevator system for waffle pack up/down

6. Use to eject pin & vacuum system for easy pickup

7. UPH : min 4,000 EA

8. PC Based & Touch Monitor Control System

   
  19  
   
  Vision System AVS-1000
 

1. Waffle Tray load & unload (wafer to waffle pack)

2. Pick up method by vacuum (Linear motor)

- Single P&P from wafer / Single P&P to waffle pack (linear motor)

3. Map File Recognition

4. Vision inspection system 4 SETS

4. Possible Conversion 8inch to 12inch (optional)

5. Elevator system for Wafer cassette up/down

6. Use to eject pin & vacuum system for easy pickup

7. UPH : min 3,000 EA ~ max 4,000 EA

8. PC Based & Touch Monitor Control System

   
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