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Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  18  
   
  Reel Packing Sytem PTR- R20

1. Wafer to Reel packing

2. Dual Pick & Place System (Total 6 unit)

Loading Pickup Tool Method by Vacuum (2 Unit Pickup)

Rotate Pickup Tool Method by Vacuum (2 Unit Pickup)

Unloading Pickup Tool Method by Vacuum (2Unit Pickup)

3. Vision Inspection System
(Wafer Alignment & Placement)

4. Map File Recognition

5. Possible Conversion 8inch to 12inch (optional)

6. PRS Vision system for Reel Placement (optional)

7. Elevator system for Wafer cassette up/down

8.Use to eject pin & vacuum system for easy pickup

9.UPH: min 3.600 EA

10.PC Based & Touch Monitor Control System

   
  17  
   
  Reel Packing Sytem PTR-D20

1. Wafer to Reel loading & Unloading

2. Single Rotate pick & place system

Separate two head pick up tool / Flipper system (Picker to Picker)

3. Map File Recognition

4. Vision inspection system

5. Possible Conversion 8inch to 12inch (optional)

6. Elevator system for Wafer cassette up/down

7. Use to eject pin & vacuum system for easy pickup

8. UPH : min 2,500 EA

9. PC Based & Touch Monitor Control System

   
  16  
   
  Laser Marker WML-10A

1. Wafer die laser marking system

2. Marker source: 532nm – Green laser

3. Wafer load & unload system

4. Vacuum arm for wafer transfer

5. Index feeding by servo motor with Vacuum

6. Vision system sets: PRS Alignment for Wafer

7. Marking area: 204 x 204 330mm (8 inch)

8. Cycle time : 0.01Sec (based on 1 font)

9. PC Based & Touch Monitor Control System

 

   
  15  
   
  Flip Chip Bonding & Ball mount WBM-10A
 

1. Ball Size: over 0.25mm / Wafer Size: 8 or 12

2. Ball Placement accuracy: +/- 0.03mm

3. Conversion time: less than 25min

4. Vision inspection system: Fiducially mark recognition

- Accuracy: +/- 0.01mm

- Automatic screen & Flux
- Ball tool alignment according to PRS

5. Adjustable squeegee pressure

- Pressure control range: 0 ~20kg +/- 0.03%

6. Cycle time : min 130sec

9. PC Based & Touch Monitor Control System

   
  14  
   
  Flip Chip Bonding & Ball mount FPP-80A

1. Dual Pick & Place System

Pickup Tool Method by Vacuum (12 unit Pickup)

2. Vision Inspection System
(Head 1, Head2, Wafer Alignment)

3. Map File Recognition

4. Possible Conversion 8inch to 12inch (optional)

5. Elevator system for Wafer cassette up/down

6. Use to eject pin & vacuum system for easy pickup

7. UPH : min 3,500 ~ max 4,000 EA

8. PC Based & Touch Monitor Control System

   
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