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Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  8  
   
  Vision Inspection & Sorting system : VI-2000
1.  Multi JEDEC Tray Loading & Unloading (Wafer to Tray)
2.  Rotate Pick & Place System
     Pickup Tool Method by Vacuum (2 Unit Pickup)
3.  Turn Table with inspection system (Top & Bottom)
4.  Vision Inspection System (Wafer Alignment & Placement)
5.  Map File Recognition
6.  Possible Conversion 8inch to 12inch (optional)
7. Flipper and Reject sorting system
8.  Elevator system for Wafer cassette up/down
9.  Use to eject pin & vacuum system for easy pickup
10.  PC Based & Touch Monitor Control System
   
  7  
   
  Tape & Reel Packing system : PTR-2000
1.  Multi  Reel Tape Loading & Unloading
2.  Rotate Pick & Place System
     Pickup Tool Method by Vacuum (2 Unit Pickup)
3. Turn Table with ball inspection system (Top & Bottom)
4.  Vision Inspection System (Wafer Alignment & Placement)
5.  Map File Recognition
6.  Flipper and Reject sorting system
7.  Elevator system for Wafer cassette up/down
 8. PC Based & Touch Monitor Control System
   
  6  
   
  Tape & Reel Packing system : PTR-1000
1. Multi JEDEC Tray Loading & Unloading
2. Multi  Reel Tape Loading & Unloading
3. Single Pick & Place System
    Pickup Tool Method by Vacuum (2Unit Pickup)
4. Vision Inspection System (Reject unit)
5.  Reject unit sorting system
6.  Elevator system for Tray up/down
7.  Use to eject pin & vacuum system for easy pickup
8.  PC Based & Touch Monitor Control System
   
  5  
   
  Flip Chip Bonding system : FCB-1000
  1.  Strip Load&Unload System 
       (Method by ACServo Motor)
  2.  Dual Pick & Place System (Pickup Tool 12ea)
  3.  Vision Inspection System
       (Head 1, Head2, Wafer Alignment)
  4.  Map File Recognition
  5.  Wafer Conversion  :  8inch to 12inch
  6.  Elevator System for Wafer Cassette Up/Down
  7.  Use to Eject Pin & Vacuum pick up System 
       (Method by CAM & AC Servo Motor)
  8.  Substrate Presentation : Strips, boats,
        carriers, Lead frames
        (Max Substrate Size : 350mm x 350mm)
  9.  Placement Accuracy  : +/- 10 Micron
10.  PC Based & Touch Monitor Control System
   
  4  
   
  Flip Chip Bonding system : FCB-120L
1. Dual Pick & Place System
    Pickup Tool Method by Vacuum (12 Units Pickup)
2. Dual Rotate Flipper system
    Pickup Tool Method by Vacuum (12 Units Pickup)
3. Vision Inspection System (Head 1, Head2, Wafer Alignment)
4. Map File Recognition
5. Possible Conversion 8inch to 12inch (optional)
6. Elevator system for Wafer cassette up/down
7. Use to eject pin & vacuum system for easy pickup
8. PC Based & Touch Monitor Control System
   
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