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Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  3  
   
  Flip Chip Bonding system : FCB-80
1. Dual Pick & Place System
    Pickup Tool Method by Vacuum (8 Units Pickup)
2. Dual Rotate Flipper system
    Pickup Tool Method by Vacuum (8 Units Pickup)
3. Vision Inspection System (Head 1, Head2, Wafer Alignment)
4. Map File Recognition
5. Possible Conversion 8inch to 12inch (optional)
6. Elevator system for Wafer cassette up/down
7. Use to eject pin & vacuum system for easy pickup
8. PC Based & Touch Monitor Control System
   
  2  
   
  Pick & Place system : PP-R20
1.  Multi JEDEC Tray Loading & Unloading (Wafer to Tray)
2.  Rotate Pick & Place System
     Pickup Tool Method by Vacuum (2 Unit Pickup)
3.  Vision Inspection System (Wafer Alignment & Placement)
4.  Map File Recognition
5.  Possible Conversion 8inch to 12inch (optional)
6. Vision inspection for tray orientation & Placement (optional)
7.  Elevator system for Wafer cassette up/down
8. Use to eject pin & vacuum system for easy pickup
9.  PC Based & Touch Monitor Control System
   
  1  
   
  Pick & Place system : PP-160
1. Multi JEDEC Tray Loading & Unloading (Wafer to Tray)
2. Dual Pick & Place System
    Pickup Tool Method by Vacuum (16 Unit Pickup)
3. Vision Inspection System (Head 1, Head2, Wafer Alignment)
4. Map File Recognition
5. Possible Conversion 8inch to 12inch (optional)
6. Elevator system for Wafer cassette up/down
7. Use to eject pin & vacuum system for easy pickup
8. PC Based & Touch Monitor Control System
   
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