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Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  3  
   
  Flip Chip Bonding system : FCB-1000
  1.  Strip Load&Unload System 
       (Method by ACServo Motor)
  2.  Dual Pick & Place System (Pickup Tool 12ea)
  3.  Vision Inspection System
       (Head 1, Head2, Wafer Alignment)
  4.  Map File Recognition
  5.  Wafer Conversion  :  8inch to 12inch
  6.  Elevator System for Wafer Cassette Up/Down
  7.  Use to Eject Pin & Vacuum pick up System 
       (Method by CAM & AC Servo Motor)
  8.  Substrate Presentation : Strips, boats,
        carriers, Lead frames
        (Max Substrate Size : 350mm x 350mm)
  9.  Placement Accuracy  : +/- 10 Micron
10.  PC Based & Touch Monitor Control System
   
  2  
   
  Flip Chip Bonding system : FCB-120L
1. Dual Pick & Place System
    Pickup Tool Method by Vacuum (12 Units Pickup)
2. Dual Rotate Flipper system
    Pickup Tool Method by Vacuum (12 Units Pickup)
3. Vision Inspection System (Head 1, Head2, Wafer Alignment)
4. Map File Recognition
5. Possible Conversion 8inch to 12inch (optional)
6. Elevator system for Wafer cassette up/down
7. Use to eject pin & vacuum system for easy pickup
8. PC Based & Touch Monitor Control System
   
  1  
   
  Flip Chip Bonding system : FCB-80
1. Dual Pick & Place System
    Pickup Tool Method by Vacuum (8 Units Pickup)
2. Dual Rotate Flipper system
    Pickup Tool Method by Vacuum (8 Units Pickup)
3. Vision Inspection System (Head 1, Head2, Wafer Alignment)
4. Map File Recognition
5. Possible Conversion 8inch to 12inch (optional)
6. Elevator system for Wafer cassette up/down
7. Use to eject pin & vacuum system for easy pickup
8. PC Based & Touch Monitor Control System
   
1 
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