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Semiconductor
Camera module
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Semiconductor > Product > Semiconductor
 
Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  5  
   
  Image Sensor Test IT-60AD (CMOS,CSP)
1.1. Multi JEDEC Tray loading

(Supply 2 / Empty 1 / Good 2 / Reject 2)

2. Pick up tool method by vacuum (6 unit pick up)

3. 6 Para testing unit

4. LED lighting use for image test

5. Contact method by pogo pin & cylinder up & down

6. Socket moving by turret system

7. Test result mapping display & save

8. Cycle time: 9 Sec (case by device spec.)

9. PC Based & Touch Monitor Control System
10. Application : 0.3 Mega ~ 8 Mega

   
  4  
   
  Image Sensor Test IT-40AD

1. Multi JEDEC Tray loading

(Supply 2 / Empty 1 / Good 2 / Reject 2)

2. Pick up tool method by vacuum
(4 unit pick up)

3. 4 Para testing unit

4. LED lighting use for image test

5. Contact method by pogo pin & cylinder up & down

6. Socket moving by turret system

7. Test result mapping display & save

8. Cycle time: 9 Sec (case by device spec.)

9. PC Based & Touch Monitor Control System

   
  3  
   
  Vision System AVS-4000

1. Waffle Tray load & unload
(Waffle pack to waffle pack)

2. Pick up method by vacuum (Servo motor)

- Single P&P for Reject Die

3. Map File Recognition

4. Vision inspection system 2 SETS

4. Possible Conversion 2 inch, 3 inch,
4 inch (optional)

5. Elevator system for waffle pack up/down

6. Use to eject pin & vacuum system for easy pickup

7. UPH : min 4,000 EA

8. PC Based & Touch Monitor Control System

   
  2  
   
  Vision System AVS-1000
 

1. Waffle Tray load & unload (wafer to waffle pack)

2. Pick up method by vacuum (Linear motor)

- Single P&P from wafer / Single P&P to waffle pack (linear motor)

3. Map File Recognition

4. Vision inspection system 4 SETS

4. Possible Conversion 8inch to 12inch (optional)

5. Elevator system for Wafer cassette up/down

6. Use to eject pin & vacuum system for easy pickup

7. UPH : min 3,000 EA ~ max 4,000 EA

8. PC Based & Touch Monitor Control System

   
  1  
   
  Vision Inspection & Sorting system : VI-2000
1.  Multi JEDEC Tray Loading & Unloading (Wafer to Tray)
2.  Rotate Pick & Place System
     Pickup Tool Method by Vacuum (2 Unit Pickup)
3.  Turn Table with inspection system (Top & Bottom)
4.  Vision Inspection System (Wafer Alignment & Placement)
5.  Map File Recognition
6.  Possible Conversion 8inch to 12inch (optional)
7. Flipper and Reject sorting system
8.  Elevator system for Wafer cassette up/down
9.  Use to eject pin & vacuum system for easy pickup
10.  PC Based & Touch Monitor Control System
   
1 
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