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Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
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  Laser Marker WML-10A

1. Wafer die laser marking system

2. Marker source: 532nm – Green laser

3. Wafer load & unload system

4. Vacuum arm for wafer transfer

5. Index feeding by servo motor with Vacuum

6. Vision system sets: PRS Alignment for Wafer

7. Marking area: 204 x 204 Ø 330mm (8 inch)

8. Cycle time : 0.01Sec (based on 1 font)

9. PC Based & Touch Monitor Control System

 

    
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  Ink jet Print Marking system : IJM-1000
1. Auto loading & unloading  : Dual Reel to Reel
2.  Laser source : Ink Jet Print Mark ( Laser type possible: customer spec.)
3. Vision system: Position and post mark lead detect inspection
4.  Applied  Font : User option  (300dpi or 600dpi)
5. U.V cure system : Fusion Model F-300
6. Easy & Quick Conversion : under 5Min
7. Full auto conversion (No needs conversion kit)
8.  PC Based & Touch Monitor Control System
    
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