1. Wafer die laser marking system
2. Marker source: 532nm – Green laser
3. Wafer load & unload system
4. Vacuum arm for wafer transfer
5. Index feeding by servo motor with Vacuum
6. Vision system sets: PRS Alignment for Wafer
7. Marking area: 204 x 204 ¨ª 330mm (8 inch)
8. Cycle time : 0.01Sec (based on 1 font)
9. PC Based & Touch Monitor Control System