▒▒▒▒홈페이지를 찾아주셔서 감사합니다.▒▒▒▒
 
Company Product Partners Patent Notice Support
 
Product
Semiconductor
Camera module
LED/OLED
Other FA
 
 
Semiconductor > Product > Semiconductor
 
Pick & Place system   Die Bonding system   Tape & Reel packing system  
Vision inspection system   Marking system   Ball mount system   Link system  

No. Image Explanation Detail view
  4  
   
  Flip Chip Bonding & Ball mount WBM-10A
 

1. Ball Size: over 0.25mm / Wafer Size: 8” or 12”

2. Ball Placement accuracy: +/- 0.03mm

3. Conversion time: less than 25min

4. Vision inspection system: Fiducially mark recognition

- Accuracy: +/- 0.01mm

- Automatic screen & Flux
- Ball tool alignment according to PRS

5. Adjustable squeegee pressure

- Pressure control range: 0 ~20kg +/- 0.03%

6. Cycle time : min 130sec

9. PC Based & Touch Monitor Control System

   
  3  
   
  Flip Chip Bonding & Ball mount FPP-80A

1. Dual Pick & Place System

Pickup Tool Method by Vacuum (12 unit Pickup)

2. Vision Inspection System
(Head 1, Head2, Wafer Alignment)

3. Map File Recognition

4. Possible Conversion 8inch to 12inch (optional)

5. Elevator system for Wafer cassette up/down

6. Use to eject pin & vacuum system for easy pickup

7. UPH : min 3,500 ~ max 4,000 EA

8. PC Based & Touch Monitor Control System

   
  2  
   
  Wafer Level Ball Mount system : WBS-1000
1. Ball Size : over 0.25mm / Wafer Size : 8inch ,12inch
2.  Placement accuracy : 30 micro (0.03mm)
3.  SCARA Robot system for Wafer loading & unloading
4. Vision System :
   -. Ball Vision : Missing, double, Different size, Black ball  
   -. PRS : Fiducially mark on Wafer / Fiducially  mark on Stencil
      => Accuracy : +/- 10micro (0,01mm)
5. Automatic alignment for Screen & fluxing and ball placement
    - Automatic Screen & flux & ball tool alignment according to PRS data
6.  Selectable by software for PKG conversion : less than 25 min
7.  Ball Loading Method by Shaking
     < Benefit>
    - Eliminate previous conversion time and adjustment for Wafer Chuck
    - Eliminate ball damage that can occurs while ball dispensing on the  Wafer Chuck
8.  Adjustable Squeegee Pressure
    - Equipped with load cell for constant  pressure control
    - Pressure control range:0~20kg +/- 0.03%
9.  PC Based & Touch Monitor Control System
   
  1  
   
  Wafer Level Ball Mount system : WBM-10
1.  Ball Size : over 0.25mm / Wafer Size : 8inch ,12inch
2.  Placement accuracy : 30 micro (0.03mm)
3.  Conversion time : less than 25 min
     Flux screen:1Min /  Wafer vacuum chuck:2Min / Drop ball Tool:1Min
4.  Vision System : Fiducially mark on Wafer / Fiducially  mark on Stencil
    -. Accuracy : +/- 10micro (0,01mm)
    -. Automatic Screen & flux & ball tool alignment according to PRS data
5.  Adjustable Squeegee Pressure
    - Equipped with load cell for constant  pressure control
    - Pressure control range:0~20kg +/- 0.03%
6.  PC Based & Touch Monitor Control System
   
1 
name subject contents
 
Home :: Company :: Products :: Contact us :: Support :: Sitemap
Copyright (c) 2010. AP TECH Co.,Ltd All rights reserved