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Dispensing system   Silicon Coating system   Die Bonding system  
Trim/Form/Singulation system   Test Handler system   Taping system  

No. Image Explanation Detail view
  19  
   
  Test Handler System Disc Type APS-10S
 
1.1. UPH / Tact time: 21,000ea / 0.171sec
   (Test 100msec)
2.2. Bin: Main 8 & 128, 256,
   512 (user spec.)
3.3. Contact Method: Bottom
4.4. Test stage: 2 stage
5.5. Parts Feeder to Bulk Type
6.6. PC Control system
   
  18  
   
  Test Handler System CLT-10D
 
1.1. UPH / Tact time: 4,000ea / 0.9sec
          (Test 140msec)
2.2. Bin: 32 (user spec.)
3.3. Contact Method: Top side
4.4. Test stage: 1stage with IS 10 inch
5.5. Tray to Tube type
6.6. PC Control system
   
  17  
   
  Test Handler System LCT-20H
 
1.1. UPH / Tact time: 21,000ea / 0.171sec
      (Test 100msec)
2.2. Bin: 128, 256, 512 (user spec.)
3.3. Contact Method: BTM or Side
4.4. Test stage: 2 stage
5.5. Parts Feeder to Bulk Type
6.6. PC Control system
   
  16  
   
  Taping System WTR-10N
 
1.1. UPH / Tact time: 9,000ea / 0.4sec
2.2. Wafer Size: 8 inch (User spec.)
3.3. Map Searching & Recognition
4.4. Vision Inspection system
5.5. Wafer to Reel Tape type
6.6. PC Control system
   
  15  
   
  Taping System LTR-20H
 
1.1. UPH / Tact time: 33,500ea / 0.106sec      (Test 20msec)
2.2. Contact Method: BTM
3.3. Electrical O/S test
4.4. Color vision system for particle etc.
5.5. Parts Feeder to Reel Tape Type
6.6. Automatic replacement function
7.7. PLC Control system
   
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